Precision Jetting Valves
Advanced non-contact jetting technology for high-speed, accurate dispensing of solder paste, adhesives, and specialty fluids
What are Jetting Valves?
Jetting valves are precision dispensing devices that use high-speed pneumatic or piezoelectric actuation to dispense small, controlled amounts of fluid without physical contact with the substrate. This non-contact method enables high-speed operation, minimal waste, and exceptional placement accuracy. Unlike contact dispensing methods, jetting valves propel individual fluid droplets through the air to the target location.
ASC International's jetting valves are designed for electronics manufacturing applications including selective solder paste deposition, underfill dispensing for BGAs, adhesive application for SMT components, and flux application. These systems are particularly valuable for rework operations, prototype production, and selective deposition where traditional stencil printing is not feasible.
Our systems integrate seamlessly with automated dispensing platforms, robotics, and inspection systems to provide repeatable, high-quality fluid deposits at production speeds. Jetting technology reduces material waste by up to 50% compared to contact methods and eliminates issues like stringing, dripping, and nozzle clogging.
Key Features & Benefits
Non-Contact Dispensing
No physical contact prevents contamination and PCB damage during dispensing
High Speed Operation
Dispense rates up to 1000 dots per second for maximum throughput in production
Precise Volume Control
Consistent deposit size from nanoliters to microliters with ±1% repeatability
Minimal Waste
On-demand dispensing reduces solder paste and adhesive consumption by up to 50%
Wide Viscosity Range
Handle fluids from 1 cP to 1,000,000 cP including high-viscosity materials
Flexible Integration
Easily integrate with SMT lines, robotics, and automated systems
Common Applications
Selective Solder Paste Deposition
Targeted solder paste application for specific components or rework
Underfill Dispensing
Precise underfill application for BGA and flip-chip packages
Adhesive Application
Surface mount adhesive and component bonding applications
Flux Dispensing
Selective flux application for wave soldering and hand soldering
Gasket & Seal Application
Precise gasket material deposition for enclosures and housings
Dam & Fill Operations
Dam creation and cavity filling for advanced packaging
Technical Specifications
Dispensing Performance
| Dispense Volume Range | 0.5nL - 50μL per deposit (model dependent) |
| Typical Dispense Volume | 5nL - 10μL (most common applications) |
| Volume Repeatability | ±1% (CV < 3% for optimal conditions) |
| Dispense Rate | Up to 1000 Hz (1000 dots per second) |
| Continuous Operation Speed | 500-800 Hz sustained (fluid dependent) |
| Dot Size Range | 0.3mm - 5mm diameter (parameter dependent) |
| Placement Accuracy | ±25μm (with precision motion system) |
| Jetting Height | 1mm - 5mm standoff (non-contact distance) |
| Optimal Jetting Height | 2mm - 3mm (minimizes satellite formation) |
| Response Time | <1ms (piezo), 2-5ms (pneumatic) |
Valve & Actuation System
| Actuation Technology | Piezoelectric or pneumatic (model dependent) |
| Piezo Drive Voltage | 24VDC (internal high voltage amplification) |
| Pneumatic Pressure Range | 1-7 bar (15-100 psi) |
| Air Consumption | 3-5 L/min @ 5 bar (pneumatic models) |
| Nozzle Orifice Size | 50μm - 500μm (interchangeable nozzles) |
| Nozzle Material | Stainless steel, tungsten carbide, ceramic |
| Valve Body Material | Anodized aluminum, stainless steel |
| Fluid Path Material | 316 stainless steel, PEEK, PTFE |
| Seal Material | EPDM, Viton, FFKM (fluid compatible) |
| Cycle Life | 100 million+ cycles (typical) |
| Maintenance Interval | 500-1000 hours (depends on fluid) |
Material Handling & Compatibility
| Viscosity Range | 1 cP - 1,000,000 cP (model dependent) |
| Low Viscosity Range | 1-100 cP (flux, low-viscosity adhesives) |
| Medium Viscosity Range | 100-10,000 cP (solder paste, adhesives) |
| High Viscosity Range | 10,000-1,000,000 cP (thick pastes, encapsulants) |
| Compatible Materials | Solder paste (SAC305, SnPb), SMT adhesives, epoxies |
| Additional Materials | Flux, underfills, encapsulants, silicones, acrylics |
| Filler Content | Up to 50% by volume (particle size < 50μm) |
| Reservoir Capacity | 3cc - 30cc cartridge (model dependent) |
| Pressure Regulation | Precision regulator with digital display (0.01 bar resolution) |
| Material Temperature Control | Heated cartridge option: 25°C - 60°C (±1°C) |
Control & Integration
| Control Interface | RS-232, Ethernet TCP/IP, EtherCAT |
| Digital I/O | Trigger input, dispense complete output, status signals |
| Trigger Input | TTL/CMOS compatible, 5-24VDC, optoisolated |
| Control Software | Windows-based GUI with parameter setup and diagnostics |
| Programming | Teach pendant, CAD import (Gerber, DXF), manual entry |
| Recipe Management | Unlimited recipes, secure storage, import/export |
| Vision Integration | Fiducial recognition, pattern matching, dispense verification |
| Process Monitoring | Real-time pressure monitoring, shot counter, error detection |
| Data Logging | CSV export, database integration, traceability features |
| Network Protocols | TCP/IP, Modbus TCP, OPC UA (Industry 4.0 ready) |
Physical & Environmental
| Valve Dimensions | 50mm × 30mm × 80mm (typical head unit) |
| Valve Weight | 200g - 500g (depending on configuration) |
| Controller Dimensions | 300mm × 200mm × 100mm (benchtop unit) |
| System Weight | 5kg - 8kg (valve + controller) |
| Power Requirements | 100-240VAC, 50/60Hz, 100W typical |
| Operating Temperature | 15°C - 40°C ambient |
| Storage Temperature | -10°C - 50°C |
| Operating Humidity | 20% - 80% RH, non-condensing |
| Mounting Options | Robot flange, XYZ gantry, manual stand |
| Cable Length | 2m standard (5m optional) |
| Safety Certifications | CE, FCC, RoHS compliant |
| Warranty | 1-year standard warranty with service support |
Note: Specifications may vary by valve model and fluid properties. Viscosity ranges and dispense volumes depend on nozzle selection and operating parameters. For detailed specifications on specific jetting valve models or fluid compatibility testing, please contact our dispensing specialists.
Dispensing Method Comparison
Compare jetting, contact dispensing, and spray coating methods to determine the optimal approach for your application.
| Feature | Jetting Valve | Contact Dispensing | Spray Coating |
|---|---|---|---|
| Substrate Contact | Non-contact (no damage) | Contact required (potential issues) | Non-contact (overspray concerns) |
| Placement Accuracy | ±25μm (excellent precision) | ±50μm (good precision) | ±500μm (area coverage) |
| Dispense Speed | Very Fast (up to 1000 dots/sec) | Moderate (limited by motion) | Fast (continuous) |
| Material Waste | Minimal (50% reduction vs contact) | Moderate (stringing, drips) | High (overspray, masking needed) |
| Selective Deposition | Excellent - precise targeting | Good - targeted application | Poor - masking required |
| Volume Repeatability | ±1% (excellent) | ±3-5% (good) | ±10-20% (variable) |
| Viscosity Range | 1 - 1,000,000 cP (very wide) | 100 - 500,000 cP (wide) | 1 - 5,000 cP (limited) |
| Maintenance | Low - minimal nozzle clogging | Moderate - tip wear, clogging | High - nozzle cleaning required |
| Equipment Cost | Medium ($5K - $25K) | Low-Medium ($2K - $15K) | Medium-High ($10K - $50K) |
| Operating Cost | Low - minimal waste | Medium - consumables, waste | High - material waste, filters |
| Setup/Changeover | Fast - recipe change only | Moderate - tip change, calibration | Slow - masking, cleaning |
| Best Applications | Selective solder paste, rework, high-mix | Underfill, gaskets, lines/beads | Conformal coating, large area coverage |
Best for: Jetting valves excel for selective solder paste deposition, rework operations, prototype production, and high-mix low-volume manufacturing where precision, speed, and minimal waste are critical. Ideal alternative to stencil printing for flexible production.
Why Choose ASC for Jetting Valves
Material-Agnostic
Handles solder paste, adhesives, coatings, and specialty fluids with one platform
Easy Integration
Drop-in compatible with existing dispensing platforms and robotic systems
Low Maintenance Design
100M+ cycle life with 500-1000 hour maintenance intervals
Direct Application Engineering
Fluid testing and parameter optimization support from dispensing specialists
Comparing dispensing methods? Read our Dispensing Methods Comparison.
Optimize Your Dispensing Process
Contact us to learn how jetting valves can reduce material waste and improve dispensing accuracy